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Hardware and Accessories / 7D copper shim 'hardware mod'
« on: September 23, 2015, 09:26:25 AM »
Just sharing my little 'hardware mod' on my 7D. Not sure if this is the right channel to post.
Got inspired from http://forum.xda-developers.com/nexus-4/general/hardmod-nexus-4-investigating-thermal-t2144652 and modding my LG G3 phone proved to be 'cooler' by 3°-4°c.
So why not on my 7D? Warranty is over anyway
Follow the steps from: https://www.ifixit.com/Guide/Canon+EOS+7D+Bent+CF+Pin+Fix-Card+Reader+Replacement/24777
You can skip Steps 1 and 2 as you dont need to remove the access ports/rubber.
There's a lot of air gap in between the Digic processors and logic board shield:
Making sure the shims covers the Digic processors nicely:
Used Arctic Silver 3 thermal paste in between the shims and chips (and in hope that the viscosity of the paste holds it up *fingers crossed*):
Also some thermal paste in between the shims and logic board shield. I polished the copper shims to a mirror finish to maximize surface area, and note the paper folded on the bottom in case the shims slides down it'll 'catch' it:
Haven't done any temperature testing but I'm sure this will help just a wee bit in dissipating heat.
The copper shims is 15mmx15mmx0.5mm and can be easily purchase from eBay. A thicker shim will close the gap between processor and shield even closer but afraid the heavier weight might slide down and muck it up.
Maybe a longer rectangular shim that covers both the Digic processors and supported by the folded paper would be better? Can't seem to find off-the-shelf rectangular copper shims thou.
Feel free to have a say what you guys think.. cheers.
Got inspired from http://forum.xda-developers.com/nexus-4/general/hardmod-nexus-4-investigating-thermal-t2144652 and modding my LG G3 phone proved to be 'cooler' by 3°-4°c.
So why not on my 7D? Warranty is over anyway
Follow the steps from: https://www.ifixit.com/Guide/Canon+EOS+7D+Bent+CF+Pin+Fix-Card+Reader+Replacement/24777
You can skip Steps 1 and 2 as you dont need to remove the access ports/rubber.
There's a lot of air gap in between the Digic processors and logic board shield:
Making sure the shims covers the Digic processors nicely:
Used Arctic Silver 3 thermal paste in between the shims and chips (and in hope that the viscosity of the paste holds it up *fingers crossed*):
Also some thermal paste in between the shims and logic board shield. I polished the copper shims to a mirror finish to maximize surface area, and note the paper folded on the bottom in case the shims slides down it'll 'catch' it:
Haven't done any temperature testing but I'm sure this will help just a wee bit in dissipating heat.
The copper shims is 15mmx15mmx0.5mm and can be easily purchase from eBay. A thicker shim will close the gap between processor and shield even closer but afraid the heavier weight might slide down and muck it up.
Maybe a longer rectangular shim that covers both the Digic processors and supported by the folded paper would be better? Can't seem to find off-the-shelf rectangular copper shims thou.
Feel free to have a say what you guys think.. cheers.