DIGIC 4 structure

Started by cosmo.lv, August 01, 2012, 03:59:29 AM

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cosmo.lv

I recently find this, maybe helpful for programmers.

Repost from: TechON



The DIGIC 4 has a structure called "PoP," which is composed of two stacked semiconductor packages. We looked inside the packages using an X-ray machine and discovered that there were two chips in the upper package.

So, we removed the upper package with a chemical solution and exposed the chips.

There were two types of memory manufactured by Samsung Electronics Co Ltd.
The upper chip was 64-Mbit NOR flash memory, the "K8P6415UQB," which measured 6,040 x 3,910 x 80?m.
The lower one was 512-Mbit SDRAM, the "K4X51323PE," whose dimensions were 8,220 x 7,545 x 110?m.

K8P6415UQB DataSheet: K8P6415UQB

K4X51323PE DataSheet: K4X51323PE


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