I recently find this, maybe helpful for programmers.
Repost from: TechON
(http://failiem.lv/down.php?i=defdkmm&n=L_2.jpg)
The DIGIC 4 has a structure called "PoP," which is composed of two stacked semiconductor packages. We looked inside the packages using an X-ray machine and discovered that there were two chips in the upper package.
So, we removed the upper package with a chemical solution and exposed the chips.
There were two types of memory manufactured by Samsung Electronics Co Ltd.
The upper chip was 64-Mbit NOR flash memory, the "K8P6415UQB," which measured 6,040 x 3,910 x 80?m.
The lower one was 512-Mbit SDRAM, the "K4X51323PE," whose dimensions were 8,220 x 7,545 x 110?m.
K8P6415UQB DataSheet: K8P6415UQB (http://www.datasheetdir.com/K8P6415UQB+download)
K4X51323PE DataSheet: K4X51323PE (http://www.datasheetdir.com/K4X51323PE+download)
TechON (http://techon.nikkeibp.co.jp/english/NEWS_EN/20090218/165866/)